LED chip and heat sink for thermal connection to solve the thermal grease, thermal paste difficult operation, uneven coating, plastic overflow problem caused by defective products.
用于LED芯片和散热器导热连接，解决了散热膏，导热膏难操作，涂不均匀，溢胶造成不良品的难题。
The mechanism of thermal expansion of hydraulic cement paste is also re searched with DSC/TG and XRD methods.
借助于DSC/TG和XRD测试手段，对水泥石的热膨胀性能变化规律进行了机理分析。
In this paper, the test method of the linear thermal expansion coefficient of hardened cement paste is studied.
本文研究了水泥石线性热膨胀系数的测试方法，并针对本试验方法制定了相关的试验制度。
The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED热阻系统的构成，对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。
The invention discloses an inner and outer wall thermal insulation paste material, a preparation method and the application thereof.
本发明公开了一种内、外墙保温浆体材料，其制备方法及应用。
The invention discloses an inner and outer wall thermal insulation paste material, a preparation method and the application thereof.
本发明公开了一种内、外墙保温浆体材料，其制备方法及应用。
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