Selecting proper glass materials can make opposite stress in Pt film and opposite anded resistance due to thermal mismatch.
选择适当材料的玻璃层，使热失配在铂膜内产生相反的应力，从而造成相反的附加电阻。
This compressive stress is derived from the lattice and thermal mismatch.
压应力主要来源于晶格失配和热失配。
Thermal mismatch in IGBT packaging, because of its multiplayer structure, will result in thermal stress, which affects the long term reliability of devices.
IGBT模块封装多层结构的热不匹配将产生热应力从而影响器件可靠性。
The effects of interfacial residual stress on the thermal mismatch of the reaction couple were also analyzed.
分析了反应偶材料热膨胀失配对界面残余应力的影响。
The effects of interfacial residual stress on the thermal mismatch of the reaction couple were also analyzed.
分析了反应偶材料热膨胀失配对界面残余应力的影响。
应用推荐