In the computations of 3d VLSI parasitic interconnect capacitance, it is very difficult to partition the boundary elements on a multi hole surface.
在3dVL SI互连寄生电容的边界元素法计算中，多孔平面的边界元划分是十分困难的问题。
It is emphasized to the moving and rolling contact of 3d elastic bodies with hole-type defect in the vicinity of contact region.
这些算例着重于在接触区附近有孔洞型缺陷的三维弹性体的移动接触。
The photoelastic coating method is used to study the phenomenon of stress concentration around the hole in the 3D braiding composite materials. Some results are obtained.
采用反射光弹技术考察了编织复合材料的孔边应力集中现象，得到了有益的结果。
Bottom hole pressure and the models of considered 3d crack propagation model in situ rock mechanics parameters, have made the assessment of situ rock mechanics parameters more realistic.
井底压力与考虑三维裂缝扩展模型时的就地岩石力学参数模型的建立，使得就地岩石力学参数的评估结果更符合实际。
Bottom hole pressure and the models of considered 3d crack propagation model in situ rock mechanics parameters, have made the assessment of situ rock mechanics parameters more realistic.
井底压力与考虑三维裂缝扩展模型时的就地岩石力学参数模型的建立，使得就地岩石力学参数的评估结果更符合实际。
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