In the close future, we are planning the development of the packing and testing projects of high-end memory, LED display drive chips towards the ultra-thin products trend.
未来计划开发高端存储、LED显示屏驱动芯片封装、测试项目，向超薄型新产品迈进。
In the close future, we are planning the development of the packing and testing projects of high-end memory, LED display drive chips towards the ultra-thin products trend.
未来计划开发高端存储、LED显示屏驱动芯片封装、测试项目，向超薄型新产品迈进。
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