There are many techniques for fabricating ceramic films such as PVD, CVD, high-temperature sintering and sol-gel method.
陶瓷薄膜的制备技术多种多样，如物理气相沉积、化学气相沉积、高温烧结和“溶胶-凝胶”法等。
To lower temperature sintering is desired for the fabrication of multiplayer microwave ceramics.
为满足多层微波元件低温烧结的需求，必须降低微波介质陶瓷的烧结温度。
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请告诉我们您关于高温烧结方面的疑问，我们帮助您解决问题！
The low-temperature sintering of UO_2 pellets in the partial-pressure oxidization atmosphere is studied.
试验研究了微氧化气氛下二氧化铀芯块的低温烧结。
The preparing method orderly comprises the steps of cold pressing molding and high temperature sintering.
制备方法为先冷压成形再进行高温烧结。
The post-processing of indirect SLS includes debinding, pre-sintering, high temperature sintering and metal infiltration.
间接法选择性激光烧结技术制备金属件的后处理工艺包括脱脂、预烧结、高温烧结以及渗金属。
The results of non-isothermal sintering tests suggested that LSCF powder possessed good low-temperature sintering activity.
非等温烧结实验表明该粉体具有良好的低温烧结活性。
A new technology for preparation of Ti-Fe alloy coating on the steel substrate was investigated by high temperature sintering method.
进行了高温烧结法在钢基体的表面上制备钛铁合金涂层的新工艺研究。
The article regards that the optimum way to prevent penetrating of slag and corroding of lining is using high temperature sintering or composite lining.
本文认为炉衬采用高温烧结或复合炉衬是控制熔渣浸入侵蚀的最佳途径。
Finally the new developments of high-temperature sintering and rapid-cooling integrated in one continuous process could realize sinter-hardening of MIM-parts.
最后把高温烧结和快速冷却组成一个连续过程，能实现MIM零件烧成品的硬化。
The slurry suitable for screen printing head 200-325 can PTC, glass, ceramics and varistors and other substrates used, mainly used in low temperature sintering of the conductor.
该浆料适用于200—325目丝网印刷，可在PTC、玻璃、陶瓷及压敏电阻器等基片上使用，主要用在较低温度下烧成的导体。
However, the traditional preparation technology needs the high temperature sintering normally, this kind of film needs high temperature resistant base, which has restricted its scope of application.
然而传统的制备工艺一般需要高温烧结，制备这类材料需要耐高温的基底，这就限制了其使用范围。
The relationships between the density, bending strength and grain size of the sintered compact and the quantity of additives, sintering temperature, sintering time were investigated .
研究了烧结坯的密度、抗弯强度、晶粒度与掺碳量、烧结温度、保温时间的关系。
The optimum sintering temperature, sintering time and proper heating-up rate were estimated in the meantime.
同时对最佳的烧成温度、烧成时间以及合理的升温速度作了预测。
The process conditions, including presintering temperature, sintering temperature and time, cooling mode and pretreatment were studied.
对烧成过程（预烧温度、烧结温度及保温时间、降温方式）及预处理工艺进行了研究。
The status and the development tendency of the low-temperature-sintering hexagonal ferrites used in the chip inductor were introduced .
介绍了片式电感用低温烧结铁氧体的现状及其发展趋势。
The status and the development tendency of the low-temperature-sintering hexagonal ferrites used in the chip inductor were introduced .
介绍了片式电感用低温烧结铁氧体的现状及其发展趋势。
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