Finally, the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique.
最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。
The article presents advantages of the dry heat technology, adhesives available, benefits of low temperature bonding and important parts in a laminating machine.
本文介绍了干热层合技术的优点，可供使用的粘合剂、低温粘合的优点及层合机的组成。
Brick works in high-temperature furnaces, maybe tiles on the shuttle, to resist high temperatures because of the high internal bonding.
砖在高温熔炉中工作，比如航天飞机上的贴的砖，因其强内部键可以抵抗高温。
That is to say brick work in high temperature furnaces, maybe tiles on the Shuttle, to resist high temperatures because of the high internal bonding.
它在能够承受高温炉的温度，例如瓷砖，能够耐受高温,因为它们有强的内部键作用。
The results prove that the initial bonding strength mostly depends on total reduction and heating temperature of al.
结果表明，轧制变形程度和铝层加热温度都是影响复合板初结合强度的主要因素。
The relationship of bonding strength and temperature are investigated.
分析了键合强度与键合温度之间的关系。
The results indicated that increasing the deformation and a proper rolling temperature may improve obviously the bonding strength.
研究表明，增加变形程度和选择合适的轧制温度能提高复合板的界面初结合强度。
Results showed that the high temperature adhesive cured at room temperature had satisfied bonding performance for graphite materials.
结果表明，室温固化型高温粘结剂对石墨材料具有良好的粘接性能。
Bonding temperature, bonding time and interlayer thickness have an obvious effect on the shear strength of the joints.
连接温度、连接时间和中间层厚度对接头抗剪强度具有较明显的影响。
As long as the pre-set current value and a good bonding time, the system based on current feedback signal auto - Regulation, will not be glued current thickness change and mold temperature rise.
只要预先设定好胶合电流值和时间，本系统会根据电流的反馈信号自动调节，胶合电流不会受到厚薄的变化和模具温度上升的影响。
Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.
介绍各向异性导电胶导电机理和粘接工艺，以及影响它的粘接可靠性因素和最佳参数的研究，如粘接温度、固化时间、粘接压力、粒子含量等。
Conclusion: Low temperature plasma treatment might be used to improve the surface wettability and bonding strength of denture base acrylic resin.
结论：低温等离子体处理树脂材料表面可提高其润湿性及粘接性。
It is deduced from the bonding parameter topological index he that a quantitative relationship must be existed between he and the thermal decomposition temperature of some sulfates.
从键参数拓扑指数一般形式出发，导出计算硫酸盐键参数拓扑指数公式，用于关联硫酸盐热分解温度的计算，结果满。
When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.
在连接温度为1403K的条件下，随着连接时间的增加，界面反应层厚度先快速增加，再缓慢增加。
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
器件键合失效主要表现为温度试验后管壳上的键合点脱落，而引起失效的原因与工艺过程和键合所涉及的材料有关。
The result shows improving complex sample's temperature is good to gain metallurgical bonding interface.
实验结果表明：提高浇注时复合试样的整体温度有利于获得界面的冶金结合。
Bonding products and strong, fast drying, storage of non-hierarchical, not precipitation, low-temperature performance and resistance.
产品粘接力强、干燥速度快、存放不分层、不沉淀、耐低温性能好。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
The strength of the coated diamond, the bonding force with the metallic matrix, heat resistance (sintering temperature of diamond bits) and conductance are all improved.
覆层后的金刚石强度、与金属胎体的结合力和抗温(烧结钻头时的温度)性能，以及导电性等有明显的提高。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The adsorption of nitrogen at high temperature can only be explained on the basis of chemical bonding between nitrogen and the zeolite surface.
氮气在高温时的吸附，只能根据氮气在沸石表面所形成的化学键来解释。
Experiments of heating bonding surface were carried out, then relationships between surface temperature and heating parameters were obtained.
进行键合面加热实验，得出各加热参数与键合面温度之间的关系。
In process parameters, the rf power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.
工艺参数中，射频功率和压强综合影响了基元数量、能量以及成分，基片温度主要影响表面扩散、原子成键。
The study results indicate that the threshold deformation at which materials of the same metal is bonding to each other decreases with increasing rolling temperature.
研究表明，同种金属复合时，随轧制温度升高．临界变形明显降低；
Transient liquid phase (TLP) bonding was applied to join TP304H stainless pipe, and the effect of bonding temperature on joint microstructure and mechanical properties was studied.
采用瞬时液相扩散焊(TLP)连接技术进行了TP 304 H不锈钢管的焊接，分析了不同焊接温度对接头组织、成分和力学性能的影响。
Laser localized bonding is an important technology to reduce the high temperature adverse effect in bonding process.
激光局部键合是有效降低键合温度的一种重要工艺。
The transmittance of smoke signal at high temperature and the bonding and technical properties of the adhesive were tested.
测试了该胶粘剂试样在高温状态下产生的烟雾信号的透过率以及常温粘接强度和工艺性能。
Various influential factors including activator, bonding-agent and transfer printing temperature etc, on transfer coating quality were discussed.
对影响转印膜质量的各种因素包括活化剂、界面剂、转印温度等进行了讨论。
The effects of temperature and retaining time in mild melt treatment on the bonding strength, surface morphology and porosity of tin coating are studied.
研究了软熔处理温度与保温时间对锡镀层的镀层结合力、镀层表面形貌和孔隙率的影响。
However, the preheating temperature should not be too high, so as to avoid matrix effects of surface oxidation and surface coating and the substrate bonding strength.
但预热温度不宜过高，以免引起基体表面氧化而影响涂层与基体表面的结合强度。
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