A flexible tape substrate for a semiconductor die to be mounted on an area thereof has a two-dimensional array of apertures formed therein around at least one side of the area.
柔韧带基片，用于将被安装于它的一个区域的半导体晶片，具有形成于其中的孔的二维阵列，该阵列环绕区域的至少一边。
The low sintering and low dielectrics substrate materials and their properties, and the organic additives for tape casting slurry are compared and analyzed.
对目前已研究和使用过的低介电常数和低烧结温度基板材料及综合性能，流延浆料有机添加剂进行了对比分析。
This system applies tape to both sides of a substrate and cuts the tape closely to the edges of the substrate.
该系统适用于切割基片的两侧，切削的部分紧贴基片的边缘带。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
Effects on the rheological behavior of slurry for tape-casting aluminum nitride substrate were studied systematically.
系统地研究了流延法制备氮化铝基片过程中影响流延浆料粘度的主要因素。
The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.
切割膜框架带、减薄的半导体衬底和C4研磨带的组件。
The invention also provides a method for the manufacture of the foregoing tape as well as an assembly comprising: a substrate;
本发明也提供了上述粘合带的制造方法和包括如下部件的组合件：基底；
The invention also provides a method for the manufacture of the foregoing tape as well as an assembly comprising: a substrate;
本发明也提供了上述粘合带的制造方法和包括如下部件的组合件：基底；
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