• Component mounting sequence is critical to the efficiency of surface mounting machines.

    元器件贴装顺序是影响贴片机工作效率的关键因素之一。

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  • Suitable for high density surface mounting .

    适用于高密度表面组装。

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  • Available for high density surface mounting.

    适用于高密度表面组装。

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  • It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.

    结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。

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  • The surface mounting sensors have the advantage of being replaced, but they can not solve the issue of monitoring dead load stress.

    表贴传感器具有可更换的优点,但不能解决恒载应力监测问题。

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  • At the same time, For the purpose of the micromation, low-power surface mounting components and double deck printed circuit board are employed.

    同时,为了达到微型化的设计目标,选用了低功耗的表贴元件、双层印制板制作电路板。

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  • The sorted white LEDs are wound on a reel for shipment, using automation equipment, so that their subsequent surface mounting can be conveniently conducted.

    筛选过的白色发光二极管用自动装置包装成卷状,这样便于后续的表面贴装。

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  • The upper surface mounting points (30) for the sheath (22) can be used for positioning of the sheath, and enable the sheath to be grouted into position in a one stage process.

    用于外壳(22)的上表面安装口(30)可用于外壳的定位,并可使 得外壳在单步骤过程中被灌浆入就位。

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  • Aiming at the image recognition and locating problems of IC in production of high-speed and high-precision surface mounting machine, tasks of IC vision detection are introduced.

    针对高速高精度贴片机生产中ic芯片的图像识别对中问题,介绍了IC的视觉检测任务,提出一种自主研发的识别与定位算法及其实现技术。

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  • Its business covers network communication, computer system integration, surface mounting technology, printed circuit boards, electricity meters, micro motors, and high frequency devices.

    其业务范围包括网络通信,计算机系统集成,表面贴装技术,印刷电路板,电表,微型电机,和高频设备。

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  • The experiment results demonstrate that the proposed algorithm enhances the precision of edge detection and satisfies the requirement of vision detecting in SMC ( surface mounting machine) mounting.

    通过实验比较,认为该方法提高了边缘提取的精度,满足了贴片机视觉检测的要求。

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  • Compact and lightweight, High breakdown voltage, Surface mounting type.

    描述: 结构紧凑,重量轻,高击穿电压,表面安装型。

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  • Compact and lightweight, High breakdown voltage, Surface mounting type.

    结构紧凑,重量轻,高击穿电压,表面贴装型。

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  • IP65: Panel receptacle ID/S… and surface-mounting receptacle IS… in mated condition or with protective cap.

    面板插座ID/S…和表面安装插座IS在插合状态或者带密封盖。

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  • IP65: Panel receptacle ID/S… and surface-mounting receptacle IS… in mated condition or with protective cap.

    面板插座ID/S…和表面安装插座IS在插合状态或者带密封盖。

    youdao

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