The substrate noise fundamental and its effect on the mixed-signal IC is introduced briefly.
研究混合信号集成电路中衬底噪声耦合反衬底噪声对模拟／数字电路的影响。
Substrate noise coupling effect often occurs in the DSM mixed signal ICs, which seriously interferes the normal performance of the analog circuits.
衬底噪声耦合是深亚微米混合信号集成电路中常见的噪声干扰效应，严重地影响了模拟电路的性能。
Finally, we consider solving the existence of substrate resistance and substrate resistance in the presence of the minimum noise figure.
最后还考虑了衬底电阻求解存以及在衬底电阻存在下的最小噪声系数。
Many new technologies, including soft switching technology, Al substrate, SMT, planar transformer and noise suppressors are applied.
样机运用了软开关技术、铝基板、表面贴装技术、平面变压器和尖峰抑制器等新技术。
The low density and highly porous substrate is highly absorbing, exhibiting noise reduction coefficients, NRC values of about 0.80 or greater.
低密度和高度多孔的基底是高度吸音的，从而显示出大于或等于约0.80的降噪系数，NRC值。
The low density and highly porous substrate is highly absorbing, exhibiting noise reduction coefficients, NRC values of about 0.80 or greater.
低密度和高度多孔的基底是高度吸音的，从而显示出大于或等于约0.80的降噪系数，NRC值。
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