The analysis showed that it was a pseudo-diffusion interface between the film and the substrate.
界面分析认为，薄膜与基体的界面为伪扩散界面。
Diffusion of oxygen in the bonding coating and substrate is mainly grain-boundary diffusion. Grain-boundary diffusion coefficient is far greater than intragrain diffusion.
氧在粘结底层和基体中的扩散是以晶界扩散为主，晶界扩散系数远远大于晶内的扩散系数。
However, cracks initialized in the diffusion layer between substrate and bond coat when TBCs were tested with low cycle fatigue at high temperature.
而在高温低周疲劳条件下裂纹是在粘结层与高温合金基体的扩散层处。
In the process of adatom diffusion, the deformation induced by the interaction of adatom and substrate plays an important role in the adatom's migration.
在表面原子扩散的过程中，由吸附原子与基体原子间相互作用引起的基体晶格畸变对表面原子的扩散运动将产生重要影响。
The results showed that diffusion coefficient and diffusive distance increased with raising of negative substrate bias.
结果表明扩散系数和扩散距离都随着负衬底偏压的增大而增大。
Last but not least the substrate surface temperature influences growth of the diamond due to surface diffusion and recombination effects.
最后但并不是最不重要的是，由于表面扩散和重新组合的缘故，基体表面温度对金刚石的生长也有影响。
A first impurity diffusion layer, which occupies a space within the semiconductor substrate, is provided separately apart from the floating gate by a predetermined distance.
在浮栅的两侧壁上，设置侧壁绝缘膜。第一杂质扩散层设置在半导体基板内，并与浮栅仅离规定的距离。
The microstructure change in the interfacial area is related to the inter-diffusion of elements between the coating and the substrate.
界面区微观结构的变化与元素在涂层和基体间的相互扩散行为密切相关。
In process parameters, the rf power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.
工艺参数中，射频功率和压强综合影响了基元数量、能量以及成分，基片温度主要影响表面扩散、原子成键。
The bonding between the coating layer and substrate is good and the diffusion occurs in the interface between them.
涂层与基体结合良好，界面附近存在元素扩散现象；
The diffusion of Ti, c, W of the substrate into the film improved the adhesion strength of the interface.
基体中的元素在薄膜中有明显的扩散，有助于提高界面结合强度。
The diffusion of Ti, c, W of the substrate into the film improved the adhesion strength of the interface.
基体中的元素在薄膜中有明显的扩散，有助于提高界面结合强度。
应用推荐