Combinatorial material chip technology provides a new way to fabricate multi-element arrays with different parameters on the same substrate by using a series of masks.
组合材料芯片技术是用一系列掩膜在同一块基片上获得含不同参数单元样品面阵的方法。
The chip includes an active proteinase film, screened chemical arrays distributed on the film and substrate microarrays.
这种化合物阵列芯片由活性蛋白酶膜、化合物阵列及底物微阵构成。
The package includes a chip carrier which has a metal substrate.
所述封装包括有金属基片的芯片支座。
The flux transformer and DC-SQUID were fabricated on same thin film substrate, avoiding the difficulty of single chip coupling alignment between flux transformer and DC-SQUID.
磁通变换器与DC—SQUID制备在同一片薄膜衬底上，避免了分立单片耦合对准的困难。
The second bumps are disposed between the second chip and the joint substrate so that the second chip can be connected with the joint substrate electrically.
以及多个第二凸块，配置在所述第二芯片与所述对接基板之间，使所述第二芯片透过所述第二凸块与所述对接基板电性连接。
The semiconductor chip is made thin by grinding a second main surface opposing to the first main surface of the semiconductor chip which is connected with the substrate.
通过研磨所述半导体芯片的与所述第一主表面相对的第二主表面，使所述半导体芯片减薄，所述半导体芯片与所述基板相连接；
At least one chip is disposed on the carrier substrate, wherein the chip has a plurality of electrodes. The electrodes are electrically connected to the conductive layers.
至少一芯片，设置于承载基底的凹槽中，其中上述芯片具有多个电极，上述电极电连接至该些导电层。
A new physical model for on-chip interconnect on high lossy substrate is proposed based on complex image theory and PEEC.
针对高损耗衬底，基于复镜像理论，结合部分元等效电路法，建立了一种新的片上互连线物理模型。
A device for generating superfine image by atoms is composed of atom beam generator, vacuum chamber, coil, laser beam, computing holographic encoder chip and substrate.
本发明是一种用原子制作任意超微细图形的装置，由原子束发生器、真空室、通电线圈、激光束、计算全息编码片和基片等构成。
The software and hardware design of the substrate control system which USES 89s52 as the main control chip, the PC's operating software and the communication protocols are given in this paper.
给出了以89s52为主控芯片的下位机系统的软硬件设计，并给出了上位机操作软件和与下位机的通信协议。
The package comprises a substrate, an adhesive layer, a chip and a wire, wherein the chip is bonded to the substrate through the adhesive layer and connected to the substrate through the wire.
该封装件包括基板、粘附层、芯片和导线，芯片通过粘附层键合到基板，并通过所述导线连接到基板。
The chip component comprises a ceramic substrate and at least one radiating element.
芯片元件包括陶瓷衬底和至少一个辐射元件。
The substrate and the chip are connected electrically by the plurality of lead wires;
多条导线，电性连接所述基板与所述芯片之间；
Substrate type suitable for thick film chip resistors automatic fine adjustment.
适用于基板式贴片厚膜电阻的自动精密调节。
This phenomenon validates the physical models of the electric field and magnetic field losses of the on-chip inductors in the substrate.
这个现象证明了电感衬底电场和磁场损耗物理模型的有效性。
The chip antenna is fabricated with metallization of a ceramic substrate, similar to chip-based SAW filters, diplexers, or directional couplers.
该芯片天线被制造为金属化的陶瓷基板的，类似的基于芯片的SAW滤波器，双工器，或定向耦合器。
After a layer of the coating has been applied to the substrate, it can be heated to cure the coating and form a crosslinked network that provides a durable chip and corrosion resistant finish.
在已向基底涂布所述涂层后，可将所述基底加热以固化所述涂层并且形成交联网络以提供耐久的抗石击和抗腐蚀面漆。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
The present invention relates to a radiation detecting chip which comprises a substrate, a radiation-absorbing material, a thermistor and a heating wire;
本发明涉及一种辐射探测芯片，包括衬底，辐射吸收材料，热敏电阻，加热丝；
The present invention relates to a radiation detecting chip which comprises a substrate, a radiation-absorbing material, a thermistor and a heating wire;
本发明涉及一种辐射探测芯片，包括衬底，辐射吸收材料，热敏电阻，加热丝；
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