The inhibitor-distorted active site has trouble converting the substrate to product before it dissociates, resulting in a lowered apparent substrate binding affinity.
扭曲抑 制剂活性部位有问题之前，它离解，导致明显的底物结合的亲和力降低转换基板产品。
Mixed inhibitors do not bind directly in the active site, and therefore do not block substrate binding, but instead bind at sites that can be proximal or distal from the active site.
混合抑制剂不直接绑定在活动现场，因此没有阻止底物结合，而是在活动现场近端或远端的网站可以绑定。
Binding status and intensity of HA coating and substrate interface.
羟基磷灰石生物涂层与基体的界面结合状态及结合强度。
Compared with other conductive metal layer, copper coating with small with stress, high mechanical strength, the plastics substrate and coating binding force is good wait for a characteristic.
与其它导电金属层相比，镀铜层具有应力小、机械强度高、塑料基体与镀层结合力好等特点。
DNA sequence revealed that 4-186 contains two amino acid substitutions, K167R and S374C, both of which locate neither the substrate - binding sites nor the metal - binding sites of EAP.
进化酶基因的DNA测序表明4 186含两个有义氨基酸置换：k16 7r和S374C，二者既不位于底物结合位点，也不位于酶的金属离子结合位点。
Competitive INHIBITION Competitive inhibitors compete with substrate for an enzyme's active site, lowering the enzyme's likelihood of binding substrate and slowing the observed reaction velocity.
竞争性抑制竞争性抑制剂与底物竞争酶的活性部位，降低酶的约束力基板的可能性，并观察到的反应速度放缓。
The coating procedure thereof is described in terms of the material selection, substrate treatment, stain primer, binding primer, surface primer, finishing and et al.
分别对材料选择、底材处理、底着色、涂一道底漆、涂二道底漆、面修色、涂面漆工艺进行了处理。
The shift in binding energy with varying coverage indicates that there is an interaction between the molecule and the substrate near the interface.
谱峰随着覆盖度改变的移动说明：在有机半导体和金属的界面处，吸附层与衬底发生了相互作用。
Cellulose binding domains improve the binding and facilitate the activity of catalytic domains on the insoluble substrate, but not on soluble substrate.
纤维素吸附区促进酶与底物的结合，有利于催化区对不溶性底物的作用，但对可溶性底物的催化作用无影响。
Various performance tests (neutral salt spray, metallic coating binding force) about rhodium plating on different substrate metal material were also studied.
同时通过中性盐雾实验、镀层结合力测试，研究和比较了不同基材上铑镀层的性能。
The functionalized CNTs are attached to the second substrate by way of the complementary binding partner (203).
通过互补结合伴侣将所述官能化的CNT连接于第二基板。
The results show that lower open circuit potential and current efficiency, higher whiteness, better coating binding force were found when the substrate was nickel;
结果表明： 不同的电镀基材在硫酸铑体系中对其阴极极化的影响不明显； 以镍为基材镀铑时， 具有开路电势低、电流效率低、白度高、结合力好等特点；
The results show that lower open circuit potential and current efficiency, higher whiteness, better coating binding force were found when the substrate was nickel;
结果表明： 不同的电镀基材在硫酸铑体系中对其阴极极化的影响不明显； 以镍为基材镀铑时， 具有开路电势低、电流效率低、白度高、结合力好等特点；
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