To consider the effect of bonding characteristics of the adhesives between the piezoelectric layer and the functionally graded ones, a linear spring layer model is adopted.

为了考虑中间压电层与上、下功能梯度层之间的粘结效果，采用线性弹簧模型以模拟界面性能。

youdao

To consider the effect of bonding characteristics of the adhesives between the piezoelectric layer and the functionally graded ones, a linear spring layer model is adopted.

为了考虑中间压电层与上、下功能梯度层之间的粘结效果，采用线性弹簧模型以模拟界面性能。

youdao