The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
第二个技术工艺涉及到使用网状焊料芯吸法及有刀片尖的焊接烙铁来除去PC B焊盘上的残余焊料。
The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
第二个技术工艺涉及到使用网状焊料芯吸法及有刀片尖的焊接烙铁来除去PC B焊盘上的残余焊料。
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