Using oil as heating medium to heat soldering tin, then disassemble it by ultrasonic vibration and consequently disassemble the PCB's components.
采用油作为加热介质对焊锡进行加热，再通过超声波振动去除电路板上的焊锡，从而把电路板上的元器件拆卸下来。
Using oil as heating medium to heat soldering tin, then disassemble it by ultrasonic vibration and consequently disassemble the PCB's components.
采用油作为加热介质对焊锡进行加热，再通过超声波振动去除电路板上的焊锡，从而把电路板上的元器件拆卸下来。
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