In the test the solder ability plating coating.
在测试电镀镀层的焊锡能力。
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
的锡焊尾，电镀。
Tin Plating on Solder Tail, Harpoon: Brass.
电镀锡焊尾，鱼叉：黄铜。
Tin Plating on Solder Tail, Harpoon: Brass.
电镀锡焊尾，鱼叉：黄铜。
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