After being unsealed, the solder pastes should be completely used under a room temperature within 24 hours.
锡膏开封后在室温下建议于24小时内用完。
All of the three solder pastes could form plump and splendid solder point, and the appearance of Sn-Pb solder point was more regular and sleek.
三种焊锡膏均可形成饱满、光亮的焊点，锡铅焊点外观比无铅焊点更规整圆滑。
B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires).
机器搅拌一般为1~3分钟，人工搅拌一般为3~6分钟（锡膏储存的时间越长，则搅拌时间越长）。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
作为目前广泛使用的耗时长的固体贴装预制件的代替品，一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
Some pastes do well with tinned surfaces but solder poorly bare copper OSP.
某些焊锡膏对于镀锡表面具有良好的效果，但对裸铜osp的焊接效果则很差。
Some pastes do well with tinned surfaces but solder poorly bare copper OSP.
某些焊锡膏对于镀锡表面具有良好的效果，但对裸铜osp的焊接效果则很差。
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