Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction.
焊料膜制造方法，装备有焊料膜的散热装置，以及半导体器件与散热装置的连接体。
The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.
选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。
The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.
选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。
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