However, in most cases, only the use of welding method, cored wire solder in the pin-hole-shaped tail.
但多数情况下，只能采用焊接的方法，将芯线焊在孔形插针的尾部。
When all the gold does not dissolve in the solder brittle failure occurs near the goldsolder interface .
当所有的金不能完全溶解在焊钩中时，就会在金与钩的界面附近发生脆性破坏。
The structure, type, test and the advantage of the brass solder in te grated air board are also put forward.
介绍了钎焊集成气路板的结构、型式与出厂试验项目的选取以及应用优势。
The preparation method for the solder in the invention comprises the steps as follows: raw material of the active solder is added to a planetary ball mill for ball milling.
本发明钎料的制备方法如下：将活性钎料原材料加入到行星式球磨机中进行球磨。
In the test the solder ability plating coating.
在测试电镀镀层的焊锡能力。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Carefully solder 2 new thin, flexible, insulated wires in place.
小心的将两条细、易弯曲并且绝缘的新导线焊接到位。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
介绍焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
Please see below picture, those letters overlap at circuit layer and solder mask. We suggest deleting the letters in solder mask layer.
如图，那些字在线路和阻焊层都有，我们建议删除阻焊上的字。
As to the complicated solder design in the engineering practice, the rationality of the design can be judged based on the factors of solder by the network method.
在实际工程中对于复杂的焊缝设计，利用神经网络的方法输入影响焊缝的主要因素，即可判断设计是否可靠。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
In the surface mounting technology, the result of the solder printing is very big to the product quantity.
在电子装联技术中，焊膏印刷的效果对产品质量关系极大。
Will the sample needs of solder part in flux in 5 to 10 seconds.
将样品需要焊锡的部分浸入助焊剂中5到10秒。
Over the years, specializing in the production of various series solder machines and all kinds of assembly equipment.
多年来，专业生产各种系列焊锡机及各种流水生产线设备。
This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.
本文简述了锡膏印刷的工艺流程，分析印刷过程中造成的相关缺陷及其产生的原因，并提出了相应的解决方法。
In addition, it was found that the cooling mode affect the brittleness tendency of the solder greatly.
同时发现，钎料的冷却方式对钎料的脆性倾向有较大的影响。
Moreover, available methods of solder alloy design and tendency of test method turning to calculation method with predictable function in solder alloy design are also elaborated.
并对现有钎料设计方法以及钎料设计由试验向具有性能预测功能的计算设计方法的发展趋势加以叙述。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
The simulation value of solder joint thermal fatigue life is 1 052 circulations. The thermal fatigue life of solder joint in SCSP is lower than the single chip package (2 656 circulations).
SCSP的焊点热疲劳寿命模拟值为1 052个循环周，低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。
We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.
本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
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