When all the gold does not dissolve in the solder brittle failure occurs near the goldsolder interface .
当所有的金不能完全溶解在焊钩中时，就会在金与钩的界面附近发生脆性破坏。
This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
As a reward for hais bravery, the solder was given a gold medal.
为了表彰他的勇敢，这个士兵被授予一块金牌。
Surface to solder are gold and clean.
待焊接的表面是清洁的金面。
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
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