The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.

应力是导致焊球失效的直接原因，进而致使器件失效。

youdao

The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.

应力是导致焊球失效的直接原因，进而致使器件失效。

youdao