This text simply introduce the technology for Sn-Ce-Ni alloy electroplating. Plating solution is stable. Coat quality is good.
本文简要介绍锡铈镍合金电镀工艺。本工艺镀液稳定，电镀层质量好。
Effects of each component content in solution, process conditions, power source on appearance of Sn deposit were studied by Hull Cell test.
通过赫尔槽试验研究了镀液中各成分含量、操作条件及电源对镀层外观的影响。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
The prepared alloy appears the alternant structure with the Pb-based solid solution and the Pb-Sn eutectic.
制备的合金呈现出铅固溶体和铅锡共晶交替排列的结构。
Function of each component in solution and process flow of bright sulfate Sn plating were introduced. Tarnish reasons of Sn deposit were analyzed.
介绍了光亮硫酸盐镀锡液中各成分作用及其工艺流程，对锡镀层变色的原因进行了分析。
Sn and Sb can form complete solid solution, so no single phase of either Sb or Sn was found in SbSn thin film.
锑锡薄膜的制备过程中发现，薄膜成份为单相的锑锡合金，未出现金属锑或锡的单相，这是由于锑与锡易于形成完全固溶体的原因。
The microstructure of the aluminum base alloys is the soft Sn phase particles distributing on the hard matrix(Al-Sn solid solution).
该合金的显微组织为硬的铝锡固溶体基体上分布着软的锡相质点。
The microstructure of the aluminum base alloys is the soft Sn phase particles distributing on the hard matrix(Al-Sn solid solution).
该合金的显微组织为硬的铝锡固溶体基体上分布着软的锡相质点。
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