The default LDAP authentication filter is (|(cn=%*)(|(&(sn=%a)(givenname=%z))(&(sn=%z)(givenname=%a)))).
默认的LDAP身份验证过滤器是 (|(cn=%*)(|(&(sn=%a)(givenname=%z))(&(sn=%z)(givenname=%a))))。
The effect of bath composition, operating conditions and additives on Sn content of electrodeposits during the process of Sn-Ni alloy electroplating in alkaline baths had been studied.
在研究碱性锡镍合金的电沉积过程中，讨论了镀液中各成分的含量、电镀工艺条件的改变及添加剂对锡镍合金镀层成分和外观的影响规律。
SN 8540 is a mixture of resins and auxiliaries. It can be used for the finishing of "fur with frost" effect, having more fixation than SN 8537.
SN 8540是树脂和多种助剂的混合物，可用于“草上霜”效应革的涂饰，其比SN 8537有更好的固定性能。
The SN-38 hypomicrons increased the solubility of SN-38 in water and were valuable for the development of the novel dosage form of SN-38.
本文制备的亚微粒大大增加了SN-38的水溶性，是一种值得研究开发的抗癌药物SN-38的新剂型。
A process for plating Sn on metal fasteners was introduced, including degreasing, halide Sn plating, oxidative blackening, polishing and varnishing.
介绍了一种金属钮扣电镀古锡的工艺，其主要工序包括除油、卤化物镀锡、氧化发黑、抛光、罩清漆等。
Paleozoic Sn polymetallic province in the northern accretionary zones of the craton, where Pb Zn and Sn polymetallic deposits were formed in Paleozoic basins with extensional tectonic background.
大兴安岭中南段古生代锡多金属成矿省，在克拉通北缘早晚古生代增生带的张裂型沉积盆地内分别生成各具特征的铅锌锡多金属矿床。
Function of each component in solution and process flow of bright sulfate Sn plating were introduced. Tarnish reasons of Sn deposit were analyzed.
介绍了光亮硫酸盐镀锡液中各成分作用及其工艺流程，对锡镀层变色的原因进行了分析。
The microstructure of the aluminum base alloys is the soft Sn phase particles distributing on the hard matrix(Al-Sn solid solution).
该合金的显微组织为硬的铝锡固溶体基体上分布着软的锡相质点。
Influence of Sn and in in silver filler metal on spreadability and joint strength is studied. Microstructure of filler metals and the mechanism of effect of Sn and in are analyzed.
研究了银基钎料中元素锡、铟对钎料铺展性能和接头的影响，分析了钎料的显微组织和锡、铟在钎料中的作用机理。
Experiment of co-deposition of Ni particles with Sn metal from alkaline stannate bath was performed and the friction performance of the resulting Sn-Ni composite coatings was investigated.
在碱性锡酸盐镀锡溶液中进行了镍微粒与锡的共沉积试验，对所得锡-镍复合镀层的磨擦性能进行了研究。
Sn and Sb can form complete solid solution, so no single phase of either Sb or Sn was found in SbSn thin film.
锑锡薄膜的制备过程中发现，薄膜成份为单相的锑锡合金，未出现金属锑或锡的单相，这是由于锑与锡易于形成完全固溶体的原因。
In addition, the composition of bright Sn-Bi plated layer is analyzed using scanning electron microscope and X-ray energy spectrograph. The result shows Bi content is 1% and Sn content is 99%.
此外采用扫描电镜、X射线能谱仪对锡铋光亮镀层的成分进行分析，结果表明铋含量为1%，锡含量为99%。
The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
Tin whiskers, growing spontaneously from Sn and Sn alloy coatings, can cause electrical shorts in the circuit and present a long-term reliability problem to the electronic industry.
锡须，一种自发从锡和锡合金层生长出来的现象，它会导致电路短路，影响电子产品长期的可靠性。
A new gravimetric method for determining Cu and Sn in the core-shell Cu-Sn bimetallic nanoparticle was proposed.
探讨了测定核壳式纳米铜-锡双金属粉的各组分含量的重量分析法。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
In this design, the magnets in the moving part are oriented in an ns-ns-sn-sn fashion which leads to higher magnetic force near the like-pole region.
在这个设计中，磁体作为运动部件依照NS - NS—SN - SN的方式导向的，这样在同名极区域能够产生更高的磁力。
Silver 40% (with Sn) , Silver 30% with Sn are free flowing alloys for ferrous, non-ferrous and dissimilar metals with good fluidity.
Ag40%Sn、Ag30Sn钎料在钢铁、有色金属、异种材料的钎焊时拥有良好的流动性。
Silver 40% (with Sn) , Silver 30% with Sn are free flowing alloys for ferrous, non-ferrous and dissimilar metals with good fluidity.
Ag40%Sn、Ag30Sn钎料在钢铁、有色金属、异种材料的钎焊时拥有良好的流动性。
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