Mainly describe the properties of SMT adhesive, application method of various process and defects appearing in use and countermeasure. Also briefly analyzes future trend of adhesive.
主要介绍贴片胶的特性、在各种工艺下的使用方法及其使用中出现的不良现象与对策等内容，并简要分析了贴片胶的未来发展趋势。
Mainly describe the properties of SMT adhesive, application method of various process and defects appearing in use and countermeasure. Also briefly analyzes future trend of adhesive.
主要介绍贴片胶的特性、在各种工艺下的使用方法及其使用中出现的不良现象与对策等内容，并简要分析了贴片胶的未来发展趋势。
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