• The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.

    本发明的切片方法,可以实现更高的光伏晶片的面积利用效率。

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  • The method for obtaining geometric topological information of CAD Models from STEP files is discussed, and a STEP based direct slicing method is proposed.

    探讨了从STEP中性物理文件中获取CAD模型几何拓扑信息的方法,提出了基于STEP的直接分层处理方法。

    youdao

  • An automatic program slicing method is proposed which applies the data flow equation algorithm to the abstract implementation structure diagram for PASCAL.

    提出在PASCAL抽象实现结构图上,采用数据流方程算法实现程序切片的自动化。

    youdao

  • The invention discloses a slicing device and a slicing method which are used for cutting roll-shaped high-strength high-modulus polyethylene fiber reinforced composite material.

    本发明公开了一种用于切割卷状高强高模聚乙烯纤维增强复合材料的切片设备和切片方法。

    youdao

  • A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.

    提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。

    youdao

  • A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.

    提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。

    youdao

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