We studied the effect of suppress pressure, sinter temperature and sinter times on density, hardness and structure of the materials in the course of preparation.
并对制备过程中的压制压力、烧结温度和烧结时间等工艺参数对材料密度、硬度和组织的影响进行了研究。
Molding pressure, sinter temperature in advance and the raise velocity of temperature were the main influencing factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YS Z电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
Molding pressure, Sinter temperature in advance and the velocity of temperature raised are the main factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YSZ电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
Molding pressure, Sinter temperature in advance and the velocity of temperature raised are the main factors for the matching of anode substrate and thin film YSZ electrolyte.
影响阳极基底与YSZ电解质薄膜共焙烧匹配性的主要因素是成型压力、预焙烧温度和焙烧升温速率。
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