The first multiplexer is selectively coupled to the transmitter or the receiver in order to let the HSDI transceiver act as a source device or a sink device respectively.
第一复用器选择性地耦接于发射器或接收器，以使高速数字接口收发机作为来源装置或终端装置。
Took a long time running of the machine, shall not be used directly touch the hand module of heat sink and other heating device, lest burns.
在机器运行较长时间时，不得用手直接触摸模块上的散热片和其它的发热器件，以免烫伤。
Due to its outstanding heat transfer capacity and compact structure, the microchannel heat sink is the best choice for cooling of high-power electron device with small volume.
微管道换热器以其换热性能卓越、结构紧凑等优点成为小体积高功率电子器件首选的新型散热方式。
The use of this device can effectively improve the steadiness, sink-resistibility, roll-weakening and overturn-preventing.
该装置的使用可有效提高船舶稳性、抗沉性、减摇性和防倾覆能力。
A device for drop-freezing experiment was improved, which consists of the cold-cavity, thermometer, controller of temperature, recorder of signals, cold sink, and environment box.
介绍一个改进的水滴冻结实验装置，它由冷腔、冷腔温度控制、水滴冻结信号检测及记录、循环散热和冷环境箱等几部分构成。
The light device may also include a heat sink housing.
照明装置还可包括热沉壳体。
This paper presents the making of a heating device, which can be used to replace the heating of oil sink or water sink in the experiment of measuring heat-sensitive resistance temperature coefficient.
本文介绍一种加热装置的制作，该装置可代替热敏电阻温度系数测量实验中的加热油槽或水槽。
Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Scanning technique.
利用声学扫描检测技术，提示了热烧毁的微波功率器件氧化铍陶瓷基片与底座金属散热片的焊接不良现象；
Provided is an electronic apparatus capable of also supplying sufficient air flow to a heat generating device other than the heat sink.
提供一种电子设备，即使对于散热器以外的发热装置也能够供给足够的空气流。
The heat pipe of the present invention has high heat conducting efficiency, and is suitable for application in the heat sink for electronic device.
本发明所提供的热管导热效率高，适合应用于电子器件的散热装置中。
Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction.
焊料膜制造方法，装备有焊料膜的散热装置，以及半导体器件与散热装置的连接体。
Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction.
焊料膜制造方法，装备有焊料膜的散热装置，以及半导体器件与散热装置的连接体。
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