It takes around 13 cubic metres of freshwater to produce a single 200mm semiconductor wafer, for example.
例如，制造出一块2分米长的半导体晶片需消耗13立方米的水。
This paper presented one single chip micro inertial measurement unit based on ordinary bulk micromachining process such as dissolved wafer process.
论文基于普通的体硅工艺设计实现了一个单片集成式硅微惯性测量组合。
Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.
这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。
Semiconductor wafer processing. Single or dual chamber, 25-wafer batch processing offers high-performance wafer cleaning, rinsing and drying.
半导体晶片处理。单或双室，25晶圆批量处理提供高晶片清洁，冲洗和脱水功能。
Single wafer processes use higher pressures than the batch processes.
单片工艺比多片工艺要用较高的压力。
Single - wafer processes use higher pressures than the batch processes.
单片工艺比多片工艺要用较高的压力。
Indeed, the silicon wafer itself is cut from a large rod of silicon, which is grown from a single crystal, and so is itself a single crystal.
实际上，硅片本身是从一根大的硅棒上切片下来，硅棒由单晶生长而成，所以芯片本身也是一种单晶。
Semiconductor wafer manufacturing: batch, semi-automated 25-wafer, single or dual chamber chemical stripping, developing and cleaning tool.
我公司再生产喷雾溶剂工具：半自动化，25晶圆，单或双室化学剥离，研发及清洁工具。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Because of the reflection on the back surface the minority carrier generation and illuminated surface photovoltage of both sides polished wafer will be higher than one of single side polished wafer.
由于背抛光面对受光面入射光的反射，使得少子产生率和受光面表面光电压都高于单面抛光片。
The ALC? is an in-line, spring assisted, single guided "wafer" check valve designed to prevent "water hammer" and "reverse" flow.
同轴、管内螺纹弹簧单导对夹式止回阀，专门用于防止水击作用和倒流现象。
Select a soluble europium salt solution as the raw material, and deposit the thin film on the single crystal silicon wafer by utilizing a three-electrode electrochemical cell.
选择可溶性铕盐溶液为原料，利用三电极电化学池在单晶硅片上进行薄膜沉积。
A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate;
一种制造喷墨打印头的方法，包括：准备具有（110）晶面取向的单晶硅晶片作为基板；
A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate;
一种制造喷墨打印头的方法，包括：准备具有（110）晶面取向的单晶硅晶片作为基板；
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