The cured material provides excellent protection for solder joints against mechanical and thermal stress such as shock, drop, and vibration in hand-held devices.
该材料在固化后可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
The cured material provides excellent protection for solder joints against mechanical and thermal stress such as shock, drop, and vibration in hand-held devices.
该材料在固化后可对手提设备中的焊接部在承受冲击、落下、震动等机械和热应力时提供优异的保护。
应用推荐