• The semiconductor substrate may be an SOI (silicon on insulator) structure.

    半导体衬底可以SOI绝缘体)结构。

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  • The micro machinery commonly is formed by a semiconductor substrate such as a silicon wafer.

    机械一般使用半导体衬底比如晶片形成

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  • In an embodiment, the method includes forming a gate dielectric layer on a semiconductor substrate.

    实施中,方法包括半导体衬底上形成栅极电介质

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  • The semiconductor structure includes a semiconductor substrate, a trench in the semiconductor substrate.

    半导体结构包括半导体板和所述半导体基板中的沟槽

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  • The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced.

    切割框架半导体衬底C4研磨组件

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  • A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.

    半导体衬底正面形成C4研磨激光烧蚀粘合

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  • Measurement circuit components are included in an integrated circuit fabricated on a semiconductor substrate.

    本发明涉及一种用于调整供应给电路电压的集成电路、电子系统和方法。

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  • A gate insulation layer may be interposed between the gate electrode and the fin of the semiconductor substrate.

    栅极绝缘层置于所述栅极电极所述半导体衬底所述之间

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  • In the first polishing step (S20), the compound semiconductor substrate is polished with a chloric polishing agent.

    第一抛光步骤(S20)中,氯抛光剂抛光该化合物半导体衬底

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  • A semiconductor device may include a semiconductor substrate, one common gate electrode, and one gate insulating layer.

    半导体器件包括半导体衬底公共栅极电极栅极绝缘层

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  • A semiconductor substrate is provided with a gate structure, and a source and drain on opposing sides of the gate structure.

    提供具有结构具有在所述栅结构相对两侧半导体衬底

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  • First of all, a mask is applied to the semiconductor substrate in order to define a window that is delimited by a peripheral edge.

    半导体基片首先涂覆模,确定一个边沿限定界限窗口

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  • The present invention generally provides apparatus and method for forming a clean and damage free surface on a semiconductor substrate.

    发明一般提供用于半导体基板上形成干净伤害表面设备方法

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  • The portion of the protective layer formed over the active region is removed to expose the active region of the semiconductor substrate.

    去除形成有源区域保护层部分暴露半导体衬底有源区域;

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  • Based on actual measurement results, the influence of process quality of semiconductor substrate wafers on epitaxial growth is described.

    本文根据实际测量结果,一叙述了半导体衬底制片质量外延生长影响

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  • The invention relates to a method of manufacturing a semiconductor substrate structure for use in a semiconductor substrate stack system.

    发明提出了一制造用于半导体衬底叠层系统的半导体衬底结构方法

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  • With IR temperature-measuring principle, a non-contact measuring system for measuring laser spot temperature on semiconductor substrate is designed.

    利用红外辐射原理,设计成半导体基片上激光温度接触测量系统

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  • More particularly, the MTJ structure may be on the semiconductor substrate, and the digit line may be adjacent the magnetic tunnel junction structure.

    具体MT J结构可以半导体衬底上以及数字线可以邻近隧道结构。

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  • These measurements include temperature and ir drop at locations on the semiconductor substrate, along with the frequency response of integrated circuit.

    这些测量包括半导体衬底上位置处温度IR以及集成电路的频率响应

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  • A magnetic random access memory device may include a semiconductor substrate, a magnetic tunnel junction (MTJ) structure, a contact plug, and a digit line.

    提供用于操作包括存储单元的随机存取存储器件的方法,该存储单元具有在衬底上的磁隧道结构的。

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  • A gate electrode may surround at least a portion of the fin of the semiconductor substrate. The gate electrode may be insulated from the semiconductor substrate.

    栅极电极完全围绕所述半导体衬底所述至少一部分并与所述半导体衬底绝缘

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  • A guard ring is formed in the semiconductor substrate to penetrate the first and second principal faces, the guard ring is surrounding the penetrative electrodes.

    以及保护布线,贯通上述第二区域的上述第一及第二主面的两面而形成上述半导体板,并包围上述至少个贯通电极。

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  • This invention discloses a semiconductor power device that includes a plurality of power transistor cells surrounded by a trench opened in a semiconductor substrate.

    发明公开半导体功率组件其包括若干功率晶体管记忆,该记忆胞被开设一半导体衬底中的沟槽所围绕

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  • The semiconductor device includes a semiconductor substrate of a first conductivity type; a well region of a second conductivity type, formed in the semiconductor substrate;

    形成在所述半导体衬底中的与所述第一导电类型相反第二导电类型

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  • A first impurity diffusion layer, which occupies a space within the semiconductor substrate, is provided separately apart from the floating gate by a predetermined distance.

    的两侧壁上,设置侧壁绝缘膜。第一杂质扩散设置在半导体基板,并浮栅仅离规定的距离。

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  • A semiconductor dynamic quantity sensor includes a semiconductor substrate that includes a movable electrode, a pair of first fixed electrodes, and a pair of second fixed electrodes.

    半导体动态传感器包括一个半导体基底,上面可移动电极一对第一固定电极,一对第二固定电极。

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  • The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad.

    发明提供抛光抛光垫具有抛光媒质情况下,用于抛光光学半导体衬底至少一种。

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  • The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) and comprises an aluminum powder, an organic vehicle, and a hydroxide.

    组合用于半导体板(1)上形成电极(8)用的膏组合物,含有铝粉末、有机质媒介氢氧化物。

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  • The semiconductor device includes a semiconductor substrate having an active region and a device isolation region defining the active region, and a resistor string formed over the active region.

    半导体器件包 括具有有源区限定有源区的器件隔离区的半导体衬底以及于有源区上方电阻

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  • Both of the right and left charge storage regions having a thin oxide layer on the semiconductor substrate, a nitride layer on the thin oxide layer and an insulating oxide layer on the nitride layer.

    电荷存储具有半导体衬底氧化物、薄氧化物层上氮化物层和氮化物层上的绝缘氧化物层。

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