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  • In the Ohmic contacts of LED electrodes, carriers have different transmission mechanisms be - tween metal electrode and semiconductor.

    在LED电极欧姆接触中,载流子在金属电极和半导体间有不同的传输机制。

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  • This results in an improved lifetime of an assembly, in which the semiconductor component is connected to an external substrate by the projecting electrode.

    这使得组件寿命得以提高,在组件中半导体元件通过凸出电极连接至外部基片。

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  • A semiconductor device may include a semiconductor substrate, one common gate electrode, and one gate insulating layer.

    该半导体器件的一种包括半导体衬底、公共栅极电极和栅极绝缘层。

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  • Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.

    还公开使用这些喷头电极总成处理半导体基片的方法。

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  • A gate insulation layer may be interposed between the gate electrode and the fin of the semiconductor substrate.

    栅极绝缘层置于所述栅极电极和所述半导体衬底的所述鳍之间。

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  • A semiconductor dynamic quantity sensor includes a semiconductor substrate that includes a movable electrode, a pair of first fixed electrodes, and a pair of second fixed electrodes.

    半导体动态量传感器包括一个半导体基底,上面有可移动电极,一对第一固定电极,一对第二固定电极。

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  • A gate electrode may surround at least a portion of the fin of the semiconductor substrate. The gate electrode may be insulated from the semiconductor substrate.

    栅极电极完全围绕所述半导体衬底的所述鳍的至少一部分并与所述半导体衬底绝缘。

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  • The present invention relates to a semiconductor component that has a substrate and a projecting electrode.

    本发明涉及具有基片和凸出电极的半导体元件。

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  • The first electrode is electrically coupled to the semiconductor layer and the second electrode is electrically coupled to the base region, at a location adjacent a bottom of the trench.

    第 一电极电耦接到半导体层,第二电极在邻近沟槽的底部的位置处电耦接到基区。

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  • The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) and comprises an aluminum powder, an organic vehicle, and a hydroxide.

    膏组合物是用于在硅半导体基板(1)上形成电极(8)用的膏组合物,含有铝粉末、有机质媒介物和氢氧化物。

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  • The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.

    电极部分设置于在半导体芯片的厚度方向上与传感器元件不重叠的位置。

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  • The electronic device is provided with a semiconductor layer composed of an oxide semiconductor material and an electrode arranged on the semiconductor layer.

    电子装置具有包含氧化物半导体材料的半导体层,和设置在上述半导体层上的电极。

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  • The electronic device is provided with a semiconductor layer composed of an oxide semiconductor material and an electrode arranged on the semiconductor layer.

    电子装置具有包含氧化物半导体材料的半导体层,和设置在上述半导体层上的电极。

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