The available methods of Seebeck coefficient of micro-scale material with MEMS structure were reviewed.
综述了微观尺度下利用MEMS结构测量硅材料塞贝克系数的已有工作。
The relationship of Seebeck coefficient and electrical conductivity in different sintering temperatures was analyzed.
研究了这种热电材料的电导率、塞贝克系数与烧结温度的关系。
Seebeck coefficient increased with increasing temperature and Y filling fraction, the maximum value of Seebeck coefficient shifted towards low temperature.
塞贝克系数随着温度的升高和Y填充分数的增加而增大，同时峰值朝低温方向移动。
Seebeck coefficient increased with increasing temperature and Y filling fraction, the maximum value of Seebeck coefficient shifted towards low temperature.
塞贝克系数随着温度的升高和Y填充分数的增加而增大，同时峰值朝低温方向移动。
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