Scanning white-light interferometry for 3D surface topography has a wide application.
白光扫描干涉法在三维表面形貌的测量中有着广阔的应用前景。
The surface topography of the diamond grinding wheel and the undeformed chip thickness were measured by using a 3D surface profiler based on scanning white light interferometry.
提出了基于扫描白光干涉原理或移相干涉原理的三维表面轮廓仪对硅片延性域磨削是否实现进行评定的光学轮廓仪法。
The surface topography of the diamond grinding wheel and the undeformed chip thickness were measured by using a 3D surface profiler based on scanning white light interferometry.
提出了基于扫描白光干涉原理或移相干涉原理的三维表面轮廓仪对硅片延性域磨削是否实现进行评定的光学轮廓仪法。
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