Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.

实验结果表明，这种改进的倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。

youdao

Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.

实验结果表明，这种改进的倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。

youdao