The reflow process relies on the temperature profile setting.
回流过程依赖于温度曲线的设定。
The reflow process is limited by component dimensions and heat resistance.
回流焊接制程会受限于零件的规格和耐热度。
In this paper, we analyze the function of the thermal reflow profile in reflow process, characteristics of reflow process, factors of thermal reflow profile.
本文全面的分析了回流焊温度曲线在回流焊工艺中的作用，回流焊工艺的工艺特点、影响回流焊温度曲线的各种因素。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
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