Some changes may cause a reflow of the whole page: for example, when a scroll bar appears.
某些改变可导致重排版整个页面：例如，当一个滚动条出现时。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
Flow Document capability enables automatic support to reflow content within an application depending on the window size, content semantics, and device resolution of the application.
FlowDocument的功能对随窗口大小，内容语义(semantics)，以及应用的设备分辨率之不同而重新流动内容提供了自动支持。
In this case, there is a repaint only (no reflow), because the layout of the element hasn't changed.
在这种情况下，只需要重绘(不需要重排版)，因为元素的布局没有改变。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
This change may be further deteriorated with size enlargement of no-reflow area.
随着无复流面积的扩大，这种变化有进一步恶化的趋势。
The fifth part is the research center of countryside labor reflow problems.
第五部分为我国农村劳动力回流问题研究的落脚点。
Strategic alliance with other printer and reflow oven company to cater to the need of the customers for total line solution.
通过和其他品牌印刷机，回流炉的战略联盟，更好地满足客户整线生产方案的需求。
The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created.
NMP的目的是为了减少烘烤的水量从塑料包装事先焊。由于水蒸发吸收的回流，可能会产生内部裂纹和失败。
So when an animation at the top of the page pushes down almost the whole page, this will cause a big reflow and can be expensive, appearing choppy to the user.
所以当一个页面顶部的动画推移了差不多整个页面时，将引发巨大的重排版动作，使用户感到动画卡顿。
Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven.
本发明提供一种用来将汽化的焊剂从回流焊接炉的气体中过滤出来的方法和焊剂管理系统。
Design stencil according to requirement of inserter soldering quality and reflow soldering technology.
根据插件焊接质量的要求，按照回流焊工艺设计印刷模板。
The successful use of the total process to control tin reflow discoloration and whisker behaviour on connectors in a production environment is described.
本文详细阐述一个完备的生产过程，它能有效地控制连接器表面锡的回流变色和锡须形成的问题。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
Once the reflow is complete, the browser redraws the affected parts of the screen in a process called repaint.
重排版完成时，浏览器在一个重绘进程中重新绘制屏幕上受影响的部分。
The problem of pure tin deposit reflow discoloration on connector was solved effectively with the new technics, which has been put into industrial production.
新工艺有效地解决了连接器表面纯锡的回流变色问题，实现了工业化生产。
The impact of prebake temperature, reflow temperature and reflow time on the effect of pr reflowing is studied.
着重研究了光刻胶的前烘胶温度、回流温度、回流时间对回流效果的影响。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
Conclusions There are the characters of more coronary artery ectasia, and more slow reflow phenomenon in PTCA related vessel in smoking patients.
结论吸烟患者冠脉病变特点为冠脉瘤样扩张或冠脉扩张症多发。吸烟患者PT CA术中相关血管慢血流现象的发生率较高。
In this paper, we analyze the function of the thermal reflow profile in reflow process, characteristics of reflow process, factors of thermal reflow profile.
本文全面的分析了回流焊温度曲线在回流焊工艺中的作用，回流焊工艺的工艺特点、影响回流焊温度曲线的各种因素。
Which lead-free wave soldering , lead-free reflow after several years of research and development, has now reached international advanced level.
其中无铅波峰焊、无铅回流焊经过几年研究开发，目前已达到国际先进水平。
The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
This equipment is mainly used to extract effective component of Chinese medicinal herb by thermal reflow.
本设备主要用于对中草药材通过热回流提取有效成份。
This paper describes newly technology trend of component mounter and green technology of ductless reflow furnance.
概述了元件安装机的最新技术动向和无通风管道再流焊炉绿色技术。
The article reviews progress in research into pathogenesis, diagnosis of coronary no-reflow phenomenon.
现对无再流现象的发病机制及诊断的研究进展进行综述。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
In the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.
在再流焊无铅化过程中，再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
This is a repaint, but only of a small part of the page instead of a reflow and repaint of a big page chunk.
这是一个重绘过程，但只影响页面的一小部分，避免重排版并重绘一大块页面。
This is a repaint, but only of a small part of the page instead of a reflow and repaint of a big page chunk.
这是一个重绘过程，但只影响页面的一小部分，避免重排版并重绘一大块页面。
应用推荐