Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
The invention further provides the quad flat no-lead encapsulation structure obtained by the method of the invention.
本发明进一步提供了一种采用上述方法获得的四方扁平无引脚封装结构。
The invention further provides the quad flat no-lead encapsulation structure obtained by the method of the invention.
本发明进一步提供了一种采用上述方法获得的四方扁平无引脚封装结构。
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