In the PCB production process transfer, the use of temporary storage. Changed the similar product cumbersome regulation.
在生产工序流程中PC B转运、暂时存放使用。改变了同类产品繁琐的调节。
In the process of print circuit board (PCB) production, the surface mount is an extremely important step, its speed directly affects the production efficiency.
在印制电路板的生产过程中，表面贴装是极为重要的一环，其速度直接影响着生产效率的高低。
The die is of fast making, high efficency, excellent quality, lower cost and so on, and is a new try of PCB contour process.
这种模具制作速度快、效率高、质量精良、成本较低，不失为印制电路板外形加工的一种新的尝试。
Used in the masking operation during wave solder process on PCB, prevented electroplating liquid immersing and polluting.
适用于PC b板含浸过程中遮蔽金手指部分和防止电镀液浸入及污染。
The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.
文章从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件装配工艺技术。
The manufacture of liquid photosensitive solder mask for PCB by screen printing is briefly introduced. The process and its quality control are also discussed in detail.
对印制板采用丝网印刷液态感光成形阻焊剂的制作进行了简单介绍，并对该制作工艺和品质控制进行了较为详细的论述。
Copper Etching is an important step in the PCB production process.
蚀铜过程是生产线路板的一个关键步骤。
And using the equipment, we can find the mistaken quickly which occur during the process of PCB production.
利用该设备，可以迅速地发现基板生产过程中出现的错误。
The basic storage unit design, the overall capacity planning, storage area planning, process flow designing, and storage area capacity planning based on EIQ-PCB etc are expounded.
详细阐述配送中心的储运单元设计、总体规模与能力规划、储区与储运模式规划、工艺流程设计以及基于EIQ - PCB的储区能力规划等原理和方法。
Therefore, CMP is a strong tool for reserving a sufficient margin in the PCB manufacture process.
所以，CMP在PCB中预备一个足够的空间中，是一个有力的工具。
Each process is a process control block (PCB) said.
每个进程有一个进程控制块(PCB)表示。
For protecting PCB in the process of gold plating.
适用于镀金过程中保护印刷电路板。
This paper discussed concept, challenges and current problems of final surface finishing process for PCB. Trend of being lead-free for electronic products was proposed.
对印制板表面终饰工艺的概念、面临的挑战及现存的问题进行了阐述，并提出了电子产品的无铅化趋势。
Good performance in adhesion, High Temperature Resistance, Solvent Resistance, Strong Holding Force, No Residual Adhesive Left. For protecting gold finger in the process of PCB.
粘性佳，耐高温、耐溶剂、保持力强、不残胶。；用于印刷线路板(PCB)过锡炉喷锡和波峰焊过程中遮蔽保护金手指。
For protecting gold finger in the process of manufacturing PCB.
过锡炉和波峰焊过程中遮蔽保护金手指。
In the process of PCB manufacture, etching is one of the most important steps to decide the final performances of products.
在印制电路制作过程中，蚀刻是决定电路板最终性能的最重要步骤之一。
PCB etching, Semiconductor manufacturing process of conveying of high purity chemical liquid.
电路板的蚀刻；半导体生产过程中输送高纯度化学液。
How improve the current process of the fine-line PCB image transfer in order to produce next generation fine-line PCB products is a challenge faced by many manufactures.
如何改进细导线印制板图像转移工艺，以便生产出高品质的PCB产品，PCB生产者面对的一个难题。
Based on PS theory, numerical contour matrix was presented to describe the machine constraints and process constraints of job shop PCB assembly optimization problem and formulate the constraint model.
基于多色集合理论，用数值围道矩阵描述了复杂PC B组装工艺流程中组装优化问题的设备资源约束和工艺约束，建立了PC B组装的优化约束模型。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
However, the scarce of basic information prevents the large-scale equipment development process; furthermore baffles the application and popularization to recycling PCB with pyrolysis technique.
但是基础数据的缺乏减缓了大型设备研发进程，进而阻碍了热解技术推广应用。
The plating copper is a key process in the production of PCB, which involves the quality assurance of metallization of PTH holes and laminate surface, and is affected by a number of factors.
电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。
The process to implement PCB form and the principles to be abided in the design of PCB are provided. The debugging plan of hardware is concisely shown.
介绍了硬件PCB板实现的一般流程及PCB板设计中应该遵循的原则，并对电路的调试过程进行了说明。
The research status, including PCB scrap components, pyrolysis process, pyrolysis products characteristics and pyrolysis devices, was introduced in general.
对废旧印刷线路板的成分、热解工艺、热解产品特性和热解设备等方面的研究状况进行了全面的论述。
The wider track provides better impedance matching at solder pad interfaces and provides better immunity to PCB manufacturing process variations.
更宽的线在焊盘接口提供更好的阻抗匹配、为PC B柔性加工过程提供更好的豁免权。
A normal process has a number of data structures associated with it in the kernel, including a stack and process control block (PCB).
在内核中，普通进程有若干数据结构与之关联，包括一个堆栈，进程控制块(PCB)。
With the development of semiconductor process technology a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路工艺的飞速发展，人们已经可以将原先的板级系统集成在一块芯片上，系统芯片逐渐成为集成电路设计的主流发展趋势。
In the production process flow of temporary storage, transhipment PCB.
在生产工序流程中PC B转运、暂时存放使用。
With the development of Printed Circuit Board (PCB), liquid photo imageable etching resist ink has become the prime process technology of the fine line graph facture.
随着印制电路板(PCB)行业的飞速发展，液态光致抗蚀油墨已逐渐成为精细导线图形制作的主要方法。
With the development of Printed Circuit Board (PCB), liquid photo imageable etching resist ink has become the prime process technology of the fine line graph facture.
随着印制电路板(PCB)行业的飞速发展，液态光致抗蚀油墨已逐渐成为精细导线图形制作的主要方法。
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