Expansion extrusion molding, extrusion molding apparatus therefor, and process for producing pressure-sensitive adhesive sheet.
膨胀挤出模塑，采用该法的挤出模塑装置，及用于制备压敏粘合剂片材的方法。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
The adhesive sheet (5) for fixing the flexible printed wiring board (4) to the fixing sheet (6) has a pressure-sensitive layer at least on one side of its porous base.
将柔性印刷电路（4）固定在固定板（6）上的胶粘剂片（5）在其多孔基材的至少一侧具有压敏胶粘剂层。
The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet and a method for cut-processing a laminated ceramic sheet.
本发明涉及用于切断层压陶瓷片的热剥离型压敏粘合片和用于切断加工层压陶瓷片的方法。
Adhesive lettering: a form of typesetting in which the alphabet is printed on a thin sheet of acetate or other material which are coated at the back with pressure sensitive adhesive.
粘贴字：可作排字用。每个字线先印在薄胶片或其他材料上，底部则涂上压感胶粘剂。
Adhesive lettering: a form of typesetting in which the alphabet is printed on a thin sheet of acetate or other material which are coated at the back with pressure sensitive adhesive.
粘贴字：可作排字用。每个字线先印在薄胶片或其他材料上，底部则涂上压感胶粘剂。
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