There are lots of particles adsorbed on wafer surface after CMP. Preference adsorption model was established according to the adsorption state.
CMP后大量颗粒吸附在芯片表面，根据颗粒在芯片表面的吸附状态，确立优先吸附模型。
There are lots of particles adsorbed on wafer surface after CMP. Preference adsorption model was established according to the adsorption state.
CMP后大量颗粒吸附在芯片表面，根据颗粒在芯片表面的吸附状态，确立优先吸附模型。
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