Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area.
典型的多层建筑板采用电源平面将提供这种热蔓延而不需要额外的专用铜领域的能力。
Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能：一个接地层、一个电源层和两个信号层。
Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能：一个接地层、一个电源层和两个信号层。
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