A via hole is formed through the interlayer insulating film and reaches a position deeper than an upper surface of the upper electrode.
贯穿层间绝缘膜形成通孔，并且该通孔到达比上电极上表面深的位置。
A via hole is formed through the interlayer insulating film and reaches a position deeper than an upper surface of the upper electrode.
贯穿层间绝缘膜形成通孔，并且该通孔到达比上电极上表面深的位置。
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