The successful synthesis of the aromatic triamine containing pyridine ring laid an important foundation for preparation of a novel hyperbranched polyimide.
这种新型含吡啶环芳香三胺单体的成功合成将为一类新型超支化聚酰亚胺的制备奠定重要的基础。
The thickness of the polyimide substrate is normalized.
对波带片聚酰亚胺衬底的厚度进行了归一化。
The paper introduces polyimide resin and its wheel's manufacturing and application.
本文介绍了聚酰亚胺树脂及其砂轮的制作和应用。
The production technology, applications and product prices of polyimide film were overviewed in this article.
综述了我国聚酰亚胺薄膜的生产技术、应用以及产品价格。
Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion.
结果，保护聚酰亚胺不受到侵蚀并且不对附着性施加不利影响。
Widely used in epoxy and polyimide, such as phenolic resin, can improve the mechanical properties of products.
广泛应用于环氧、聚酰亚胺、酚醛等树脂中，可有效提高制品的机械性能。
Method for preparing 1, 4-di (2, 4-diamino phenoxy) benzenoid form polyimide film for flexible copper clad plate.
柔性覆铜板用1,4 -双(2,4 -二氨基苯氧基)苯型聚酰亚胺薄膜的制备方法。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。
Compared with polyimide, PAI has been much improved in the performances as in adhesion, wearingproof, creeping and shaping.
与聚酰亚胺相比，其在粘接性、耐磨性、蠕变性、易加工成型性等方面均有很大提高。
The contact bulges under the bridge are achieved by the full etching and partial etching of the polyimide sacrificial layer.
在工艺上，特别采用了对聚酰亚胺牺牲层进行全刻蚀和半刻蚀的改进加工流程来实现桥背面的接触点。
The influence of the ratio of polyimide and graphite on the mechanical properties of the graphite sliding blades is studied.
研究了聚酰亚胺与石墨的配比对石墨滑片力学性能的影响。
The influence of the ratio of polyimide and graphite on the mechanical properties of the graphite sh 'ding blades is studied.
研究了聚酰亚胺与石墨的配比对石墨滑片力学性能的影响。
The composition, the molecular and the characteristics of polyimide (PI) fiber as a precursor of carbon fibers were introduced.
介绍了作为碳纤维前驱体的聚酰亚胺（PI）纤维的组成、分子结构和特性；
The synthesis route and preparation technology of the branch polyimide foam and polyimide nano-foam were introduced emphatically.
并介绍了侧链型聚酰亚胺泡沫塑料以及聚酰亚胺纳米泡沫塑料的合成路线和制备工艺。
The changes of structure and its effect on performance of polyimide film have been studied at different carbonization temperature.
研究了聚酰亚胺薄膜在不同碳化温度下，材料内部结构转变规律及其对材料性能的影响。
The barrier layer (22) is then deposited in contact with the last interconnect (16) layer and bounded by the polyimide layer (22).
随后沉积阻挡层(22)使其接触最后的互连层(16)并由聚酰亚胺层(22)定界。
On this basis a new method for fabricating polyimide ridge waveguides by photobleaching technique and using metal mask is proposed.
并在此基础上，提出了以金属掩模，利用光漂白技术制备聚酰亚胺脊型光波导的新方法。
The humidity sensor device consists of comb electrodes, a comb polysilicon heater and the polyimide as the moisture sensing material.
本文研究的新型结构由梳状铝电极、梳状多晶硅加热条以及用作感湿材料的聚酰亚胺组成。
The measuring grid is formed by etching Constantan foil, which is then completely sealed in a carrier medium composed of polyimide film.
测量网格是由康铜箔片构成的，然后完全密封于一个由聚酰亚胺薄膜组成的介质载体。
The tensile strength of polyimide film will also be affected by the temperature of de-solvent and the heating way of thermal imidization.
不同的去溶剂温度和热亚胺化的升温方式对聚酰亚胺薄膜拉伸强度也有较大的影响。
Photosensitive polyimide (PSPI) that possessed both heat-resistant and sensitive properties has attracted great interests in many fields.
光敏聚酰亚胺(PSPI)是兼有耐热性能和感光性能的一类高分子材料。
The closed cell polyimide foams were fabricated by foaming the precursor balloons, and the foams' acoustic absorption properties were tested.
采用前驱体微球法制备闭孔聚酰亚胺泡沫，并对其吸声性能进行了研究。
Pd, Pt and their alloy films on polyimide were prepared by Catalyst-Enhanced Chemical Vapor Deposition (CECVD) under the carrier gas (N2, O2).
以N2，O2作载气，通过催化增强化学蒸气沉积（CECVD）分别制得在聚酰亚胺上的金属铂、钯及其合金薄层。
Poly (ether imide) (PEI) is a modification kind of high performance polymer, which adds a ether bond to macromolecular chain of polyimide (PI).
聚醚酰亚胺(PEI)是在聚酰亚胺(PI)链上引入醚键形成的一类高聚物。
Base materials for printed circuits. part 2: specifications. specification no 15: flexible copper - clad polyimide film, of defined flammability.
印刷电路用基材。第2部分：规范。15号规范：规定易燃性的包铜软聚酰亚胺薄膜。
Base materials for printed circuits. part 2: specifications. specification no 15: flexible copper - clad polyimide film, of defined flammability.
印刷电路用基材。第2部分：规范。15号规范：规定易燃性的包铜软聚酰亚胺薄膜。
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