Changes of microstructure of the thick film platinum resistance paste during drying and sintering were studied by SEM. The main factors influencing tightness of the sintered membrane were discussed.
通过扫描电镜分析，研究了厚膜铂电阻浆料在烘干、烧结过程中微观结构的变化，讨论了烧结过程中对膜层致密度的影响因素。
The effect of the inorganic ingredient of the paste on the microstructure of the platinum electrode was investigated by field emission scanning electron microscope.
利用场发射扫描电镜研究了浆料的无机成分对烧成的铂电极微结构的影响。
The effect of the inorganic ingredient of the paste on the microstructure of the platinum electrode was investigated by field emission scanning electron microscope.
利用场发射扫描电镜研究了浆料的无机成分对烧成的铂电极微结构的影响。
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