• Proper use of special plating techniques, such as conforming anodes and robbers, can control plating thicknesses and runouts.

    采用适当的电镀技术诸如阳极化和附加阴极技术可以控制镀层的厚度和范围。

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  • Hot dip galvanized process flow: finished Pickling - washing - plating solution - drying - plating - cooling - Medicine - Cleaning - polishing - hot dip galvanized finish.

    热镀锌工艺流程:成品酸洗-水洗-加助镀液-烘干-挂镀-冷却-药化-清洗-打磨-热镀锌完工。

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  • Several in-service fractures have been attributed to improper plating technique, poor-quality plating, improper runout conditions, and base metal damage caused by poor blending or machining control.

    使用中发生断裂主要是因为电镀不当、电镀质量低下、过渡段不当以及由于融合或加工控制不当使本体金属而受损。

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  • The implementation procedure, plating performance and concrete application effect of chemical plating are expatiated in the article.

    介绍了化学镀工艺的实施过程、镀层的性能和具体应用效果。

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  • Light plating: in the right conditions, can be obtained directly from the plating slot have burnish of plating coating.

    光亮电镀:在适当条件下,从镀槽中直接得到具有光泽镀层的电镀。

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  • Some additional salt can improve the deep plating solution, scattered ability, ability to create a fine plating.

    有些附加盐还能改善镀液的深镀能力﹐分散能力﹐产生细致的镀层。

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  • Special treatment is recommended to activate beryllium copper surface before chromium plating. And special steps which differ from conventional chromium plating on steel parts are to be taken.

    在铍青铜合金上电镀铝,需在镀铝前作特殊的表面活化处理,镀铬时也有不同于钢铁件镀铬的操作方法。

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  • For example steel base plated copper, nickel, chromium plating, low layer again tin bronze chrome, multi-layer nickel chrome plating nickel ferroalloy, chrome, and so on.

    例如钢基上镀铜、镍层再镀铬、低锡青铜上镀铬、多层镍上镀铬、镍铁合金镀层上镀铬等等。

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  • If the plating runouts are blended or machined to remove the abrupt plating edge, the techniques must be well controlled to avoid damaging the adjacent base metal.

    如果必须将镀层上过渡段融合或切削掉来去除镀层的凸变边沿,工作人员必须严格控制,防止损伤临近的本体金属。

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  • Aluminium is the hard plating metal, there is no plating liquid to aluminium material direct chemical ni - p.

    铝是一种难镀的金属,没有适合铝材直接化学镀镍的镀液。

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  • The new plating deposits frequently are thicker than the original design configuration and deterioration of the plating adhesion.

    新的镀层通常比初始设计的构型厚并使镀层的粘性减弱。

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  • Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.

    综述了接插件连续镀金、、的电镀工艺,包括设备、液和镀层性质。

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  • Is the copper plating process an electrolytic acid copper plating system?

    电镀站是否有酸解电镀铜系统?

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  • Plating: plating is the application of a metallic deposit on the surface of the fastener by electrolysis, impact, or other suitable means.

    镀层:是在紧固件表面上用电解作用、电解作用,脉冲或可靠方法粘附金属。

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  • Silver plating provides the best possible connection, regardless of plating on the equipment jacks.

    不论所要电镀之接头器材为何,镀银方式是最佳的连接方式。

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  • Do the plating current and program used match the design and traveler? What is the ASF range used during plating? Who determines ASF? How?

    电镀电流与程序是否符合设计要求?电镀时的ASF范围是多少?谁确定ASF?如何确认?

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  • Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.

    镀镍前或锡电镀间的阴极接触不良,放电火花将铜材熔成凹洞。

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  • The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.

    该孔金属化工艺是整个刚挠结合板生产制造工艺的核心,包括钻孔、去钻污、化学镀铜、电镀铜等工序。

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  • The major problems of brush plating bath and the effect of soluble and non-soluble positive pole on various brush plating baths in iron plating are discussed.

    本文研究了电刷镀铁镀液存在的主要问题,可溶性阳极和不溶性阳极对电刷镀铁不同类型镀液氧化的影响及原因。

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  • Combined the condition and requirement of the research project, experimental research are done to the fundus material, plating material and the technics of plating of laser chaff.

    根据课题研究需要并结合实际条件,对激光箔片的基底材料和镀层材料进行了分析,并对镀层工艺进行了试验研究。

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  • Then, black Sn-Ni alloy plating and ti carbide ion plating, quite well received currently, are discussed.

    其次是黑色镀层,探讨了目前较受欢迎的电镀黑色锡镍合金及离子镀碳化钛。

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  • Hang the lower limit, and concentration of plating wire, strip continuous plating, upper limit concentration can be used.

    吊镀采用下限浓度,而线材、带材连续电镀可用中、上限浓度。

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  • Plating: gold, brass, copper, nickel or any metal plating.

    金属表面镀层:黄金,黄铜,铜,镍或其他金属镀层。

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  • Winning, refining, plating, synthesis Winning, refining, plating, synthesis.

    提炼,精炼,电镀,合成。

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  • It is among the most useful tools available to the plating chemist for control of plating baths.

    对电镀化学工程师来说,它是控制电镀槽最有用的工具。

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  • A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested.

    介绍餐具光亮镀银的全套实用工艺,包括化学抛光、机械抛光、除蜡、除油、镀镍、镀银、以及镀后处理等。

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  • It has been proved to be more suitable for barrel plating than rack plating.

    实践证明:该工艺用于滚镀较挂镀锌更为优越。

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  • The pretreatments of plating and decoration on metal parts are important for insuring the plating quality.

    金属零部件电镀与涂饰前处理是保证被涂层质量的重要工序。

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  • Has suspended plating production line, plating production lines rolling.

    拥有吊镀生产线,滚镀生产线。

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  • The existing problems of plating industry and plating base building in Guangdong province were analyzed, and the suggestions for improvement and achieving perfection were presented.

    分析了广东省电镀行业及电镀基地建设存在的问题,提出了完善和改进意见。

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