Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.
硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。
A new kind of non-cyanide alkaline strike copper plating process for zinc alloy die-castings was developed in order to solve the problems in traditional non-cyanide strike copper plating.
为解决传统的锌压铸件无氰预镀铜存在的一些问题，提出了一种新的锌合金压铸件无氰碱性预镀铜工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
The process formula of acid bright copper plating, acid bright nickel plating, (silver) plating and various colour gold plating on fresh flowers were presented.
并给出了鲜花上酸性光亮镀铜、酸性光亮镀镍、镀银以及镀各种彩色金的工艺配方。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
The results indicate that the process of copper autocatalytic plating on plastics is simple. Property of plating is stable.
结果表明：塑料自催化镀铜的工艺简单，镀层的性能稳定。
The potential-time curves under constant current and cyclic voltammetry curves were measured, and the potential activation process of copper plating on iron substrate in cyanide electrolyte was shown.
进行了恒电流电位-时间曲线和循环伏安曲线的测定，显示了铁电极进行氰化物镀铜时，镀层沉积前铁表面的电位活化过程。
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
The process satisfies the demands of environmental protection and can replaces the cyanide copper plating for preve…
该工艺复合环保要求，可以取代防渗碳氰化镀铜工艺。
The plating copper is a key process in the production of PCB, which involves the quality assurance of metallization of PTH holes and laminate surface, and is affected by a number of factors.
电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。
And in this article, various process parameters such as electrolysis alkali wash, pickling and chemical displacement copper plating, testing equipment type and anneal process are given.
文中给出了电解碱洗、酸洗及置换镀铜时各种工艺参数及所用试验设备型号及拉拔退火工艺。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
A process for continuous copper plating on steel wire at high current densities was described in detail.
介绍了高电流密度连续生产钢芯镀铜线工艺。
The disadvantages of common electroless copper plating process were pointed out.
指出了普通镀铜工艺的缺点。
The effect of rare earths on the chemical pre-plating process for electro-deposition of foamy copper was studied through experiments.
通过实验手段，研究了稀土对电沉积法制备泡沫铜化学预镀工艺的影响。
Process of copper autocatalytic plating on ABS plastic, polyvinyl chloride, polyester film have been studied in this investigation.
本文研究了ABS塑料、聚氯乙烯、聚酯薄膜的自催化镀铜工艺。
A new non-cyanide alkaline copper plating process was introduced.
介绍了一种新的无氰碱铜工艺。
The copperplating process of graphite powder was investigated and the optimum process parameters were obtained by comparing the copper-plating results.
研究了用刷镀镀铜防渗碳时的工艺参数对镀层防渗碳效果的影响 ，及渗碳时间与防渗碳所需的最小镀层厚度之间的关系。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Tin plating: Immediately after copper plating, a thin layer(0003") of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process."
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
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