A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
Author made selection and experiment for brighteners and stabilizers which are used for acidic bright tin plating. More ideal brightener and stabilizer are obtained through the experiments.
作者对酸性光亮镀锡的光亮剂及稳定剂进行了选择，并作了试验，获得了较为理想的光亮剂和稳定剂。
The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.
通过实验分别测定了酸性镀铜光亮剂ubac1a和镀液中硫酸铜的吸收曲线。
Characteristics of the new generation brightener for nickel plating were introduced. Mechanism producing these characteristics was discussed.
对新一代镀镍光亮剂的特点做了介绍，对产生这些特点的机理做了探讨。
By using sulfobetaine derivant as leveling agent and polybasic acid as complexant of interfering ions, the brightener SN-1 for nickel plating is developed.
以磺基甜莱碱的衍生物为整平剂，多元有机酸为干扰离子络合剂，研制了SN - 1镀镍光亮剂。
Carrier of brightener ACTS as fining the crystal size, making main brightener more soluble in chloride zinc plating.
载体光亮剂在氯化物镀锌中起着细化晶粒和增加主光亮剂溶解度的作用。
Results show the brightener has high cloud point and excellent properties, it can be used in high concentrated sulfate bath for high speed and continuity Zn - plating, also rack and barrel Zn-plating.
结果表明，该光亮剂具有很高的浊点和优越的电镀性能，既适合在高浓度的硫酸盐镀液中进行高速连续电镀，又可用于挂镀和滚镀。
Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.
主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。
Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.
主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。
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