Together with the advanced planar cell design of the IGBT and the sophisticated lifetime engineering of the diode, this chip set offers an unprecedented safe operating area.
先进的IGBT平面元胞设计同二极管精密的寿命控制工程相结合，这样的芯片就具备了崭新的安全工作区。
A new planar parallel positioning mechanism is presented, which can be used as the high-speed and high-precision table in the chip-packaging application.
面向芯片封装领域对高速高精度平台的需求，提出一种新型平面并联定位机构。
This thesis study the simulation of electromagnetic field of MB chip and two key fabrication processes—fabrication of planar electromagnetic devices based on UV-LIGA and polymeric microfabrication.
本论文研究了磁珠芯片中的电磁场模拟分析，以及两种关键工艺——基于UV-LIGA的平面电磁器件制作工艺和塑性材料微加工制作工艺。 在此基础上，设计、制作并封装了新型磁珠微芯片。
The coupling characteristics of tapered and lensed fiber (TLF) and semiconductor MQW planar lightwave circuit (PLC) chip was investigated experimentally.
对锥形透镜光纤(TLF)与半导体多量子阱(MQW)平面光波光路(PLC)芯片的耦合特性进行了实验研究。
The coupling characteristics of tapered and lensed fiber (TLF) and semiconductor MQW planar lightwave circuit (PLC) chip was investigated experimentally.
对锥形透镜光纤(TLF)与半导体多量子阱(MQW)平面光波光路(PLC)芯片的耦合特性进行了实验研究。
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