• Most LOGIC CIRCUITs have a ground pin at one of the PACKAGE corners and therefore the lid is grounded.

    绝大多数逻辑器件接地引脚都设计封装某个角所以金属框可以方便地接地。

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  • The process is like a package gnocchi dumplings, but do not Rolling pin.

    汤团过程饺子不用擀面杖

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  • The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.

    器件提供两种封装:24引脚、0.3英寸塑料密封双列直插式封装(DIP)24引脚形集成封装(SOIC)。

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  • Our main products include pin, block, piston and sleeve, which are mainly used in engineering machine, wind generator and food package machine.

    主要产品轴,阀活塞衬套等主要应用工程机械风力发电机食品包装机械三个领域。

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  • The invention involves the integrated circuit package domain, to be specific, involves when galvanizes to the base pin, prevents the permutation reaction the method.

    发明集成电路封装领域具体地说,涉及对管电镀防止置换反应方法。

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  • The surface of the molded package is textured when it is removed from the mold. The pin cavities are often very smooth as you can see in the previous picture.

    芯片塑封表面模具取出来时具有一定纹理的,指示引脚凹槽通常都是光滑的,就前面看到图片一样。

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  • The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."

    器件提供封装:8引脚、0.3英寸小型塑料密封双列直插式封装(小型DIP);以及8引脚小形集成封装(SOIC)。

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  • Pin grid array (PGA) ApplicationThis package is equipped with advanced IC chips, such as ASIC, used mainly for the mpu of a computer and communications equipment.

    引脚网格阵列(PGA)用途主要供给高ic使用ASIC等高功能芯片,主要使用于计算机MPU通信设备等里面。

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  • Pin grid array (PGA) ApplicationThis package is equipped with advanced IC chips, such as ASIC, used mainly for the mpu of a computer and communications equipment.

    引脚网格阵列(PGA)用途主要供给高ic使用ASIC等高功能芯片,主要使用于计算机MPU通信设备等里面。

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