Repair and rework on Transceiver Module assembly and related PCBA.
维修和返工光收发器模块组件，和相关的PC BA板。
Is the machine Program Name traceable to the PWB and PCBA part number?
是计算机程序名称可追溯到印制线路板及PCba部件号吗？
Is reworked PCBA re-input to manufacturing test and inspection stations?
维修之PCBA是否有再投入产线测试与检查?。
PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.
PCBA表面三防涂覆、堤坝工艺、涂防焊胶、DIP元件加固等。
Experience preferable with 8D problem solving, failure analysis, QC tools of PCBA, reliability testing.
有8D问题解决，品质不良分析，PCBAQC工具管理，可靠度测试经验优先。
Mobile power sets of materials, batteries, programs, wire, packaging, PCBA, lithium battery management IC;
移动电源套料，电芯，方案，线材，包装，PCBA、锂电池管理IC；
It is intended to provide an assessment of PCBA Manufacturing Capability based on PCBA Manufacturing Complexity.
此文件的目的，是提供一个基于PCBA制造复杂性的对pcba制程能力的评估方法。
Do not touch the components in the PCBA in order to prevent from destroying the board when use the wire, soldering iron.
使用中注意引线头、烙铁等不要碰到电路板上的元器件，否则有可能损坏本电路板。
We are specialized in providing PCBA manufacturing service, as well as OEM/ODM development to industrial electronics customer.
我们专注于为工业类电子行业客户提供专业的PCBA 和ODM/OEM 高品质产品生产服务。
Familiar with PCBA test process and strong at failure analysis. Capable of interpreting electrical drawings, gerber files and schematics preferred.
熟悉pcba测试流程，故障分析能力强，熟悉控制电气线路图，有制图能力更佳。
We solve the problem of sticking and identification marking of PCBA and electronic components with durable high performance labels, printing systems and die cut parts.
我们生产和销售的高性能标识，打印系统，精密模切部件可以帮助PCBA厂商，电子器件和设备加工商解决标识和粘结方面的需求。
Being faced with the problems found in detection of printed circuit board assembly (PCBA) at present, a new method of PCBA detection which is economical, rapid and reliable is promoted.
针对目前印刷电路板组装件(PCBA)检测存在的问题，从经济、快捷、可靠的角度出发，提出了一种新的检测方式。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
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